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Minggu, 17 Juni 2018

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Failure of electronic components - Wikipedia
src: upload.wikimedia.org

The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.


Video Heat generation in integrated circuits



Joule Heating

Joule Heating is a predominant heat mechanism for heat generation in integrated circuits and is an undesired effect.


Maps Heat generation in integrated circuits



Propagation

The governing equation of the physics of the problem to be analyzed is the heat diffusion equation. It relates the flux of heat in space, its variation in time and the generation of power.

? ( ? ? T ) + g = ? C ? T ? t {\displaystyle \nabla \left(\kappa \nabla T\right)+g=\rho C{\frac {\partial T}{\partial t}}}

Where ? {\displaystyle \kappa } is the thermal conductivity, ? {\displaystyle \rho } is the density of the medium, C {\displaystyle C} is the specific heat

k = ? ? C {\displaystyle k={\frac {\kappa }{\rho C}}\,}

the thermal diffusivity and g {\displaystyle g} is the rate of heat generation per unit volume. Heat diffuses from the source following equation ([eq:diffusion]) and solution in an homogeneous medium of ([eq:diffusion]) has a Gaussian distribution.


Jack Kilby, Bob Noyce and the 3D Integrated Circuit
src: www.monolithic3d.com


See also

  • Thermal simulations for Integrated Circuits

Evolution and Generation of Computers - ppt video online download
src: slideplayer.com


References

Source of the article : Wikipedia

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